Hello all:
We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip)
BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch: 0.80 mm
The current method we've used (BGA reballing by applying ball and flux) is just ok for small volume only.
Barlow
2017/2/4 1:05:40
I was really confused, and this answered all my qutoiesns.
Yucel Calik
2017/2/4 1:05:40
Remarkable.
CurveAudioDesign
2017/2/4 1:05:40
Impressive
Beetlesmart
2017/2/4 1:05:40
You are a genuis!
efem elec. co.
2017/2/4 1:05:40
Really helpful.