Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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High Volume BGA re-balling
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Hello all:
We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip)
BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch: 0.80 mm
The current method we've used (BGA reballing by applying ball and flux) is just ok for small volume only.
Statement: This post is only the personal view of the author and does not represent the opinions of


I was really confused, and this answered all my qutoiesns.

Yucel Calik





You are a genuis!

efem elec. co.

Really helpful.

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