My Message
Suggestions
Hi all
I am facing the problem with reworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is too less to print solder paste. Anyone has any solution or guideline to rework this type of component or know the type of tacky fluxe that used for High frequency application pls. help advise. Thanks very much.
sami
3/1/2017 3:54:44 AM
It is pretty helpful to my daily learning.
Broderick
3/1/2017 3:54:44 AM
Nice sharing. What you share in this article is very useful. I will follow you and keep reading your posts.
filippo.lalli
3/1/2017 3:54:44 AM
Great help to my new project.
Carl
3/1/2017 3:54:44 AM
Quite good posting. Your knowledge is quite impressive and useful to me who is new beginner. Hope you can write more posts and I will keep on reading.
giuliocirilli
3/1/2017 3:54:44 AM
Quite useful and impressive info.Thanks for marvelous posting.