High frequency application board and rework CSP

2017/2/27 3:54:44

Hi all
I am facing the problem with reworking CSP component for high frequency application boards. Our customer do not allow us to use tacky fluxes due to high frequency application and component has low standoff ,and the ball pad and ball size is too less to print solder paste. Anyone has any solution or guideline to rework this type of component or know the type of tacky fluxe that used for High frequency application pls. help advise. Thanks very much.


2017/3/1 3:54:44

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2017/3/1 3:54:44

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2017/3/1 3:54:44

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2017/3/1 3:54:44

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2017/3/1 3:54:44

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