My Message
Suggestions
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is caused by die, die attached paste, wire bonding, encapsulant, popcorn, or thermal mismatch? Could someone please list some of theanalysis methods and providers?
Account
Antonio Semeraro
3/2/2017 6:48:59 AM
I have learned a lot from your article. Quite useful and impressive info.
boonkienkhoo
3/2/2017 6:48:59 AM
It is very interesting and helpful.I will keep check your post.
Ahmad Faraz Khan
3/2/2017 6:48:59 AM
Great help to my new project.
kelvint
3/2/2017 6:48:59 AM
Impressive and helpful.