Hi,
Help! Could anyone help to enlighten me on this?
Question:
If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing machine that able to effective performing the cleaning on component's bumps after attachment on PCB? ( Assume that water pressure is 60 PSI)
Thank you in advance!
Reply 2017-02-28 05:53:33
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