Help! Could anyone help to enlighten me on this?

2/28/2017 5:53:33 AM

Hi,
Help! Could anyone help to enlighten me on this?
Question:
If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing machine that able to effective performing the cleaning on component's bumps after attachment on PCB? ( Assume that water pressure is 60 PSI)
Thank you in advance!

Robert Fransson

3/2/2017 5:53:33 AM

Very impressive posting. Thank you for your efforts.

Conrad

3/2/2017 5:53:33 AM

Quite useful and impressive info.

Factor

3/2/2017 5:53:33 AM

Very valuable!

Chris Bethea

3/2/2017 5:53:33 AM

Interesting and useful!

Sebastian Charlak

3/2/2017 5:53:33 AM

Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.

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