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Hi,
Help! Could anyone help to enlighten me on this?
Question:
If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing machine that able to effective performing the cleaning on component's bumps after attachment on PCB? ( Assume that water pressure is 60 PSI)
Thank you in advance!
Robert Fransson
3/2/2017 5:53:33 AM
Very impressive posting. Thank you for your efforts.
Conrad
3/2/2017 5:53:33 AM
Quite useful and impressive info.
Factor
3/2/2017 5:53:33 AM
Very valuable!
Chris Bethea
3/2/2017 5:53:33 AM
Interesting and useful!
Sebastian Charlak
3/2/2017 5:53:33 AM
Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.