Help! Could anyone help to enlighten me on this?

2017/2/28 5:53:33

Hi,

Help! Could anyone help to enlighten me on this?

Question:

If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water clean washing machine that able to effective performing the cleaning on component's bumps after attachment on PCB? ( Assume that water pressure is 60 PSI)

Thank you in advance!

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Post Comment

Robert Fransson

2017/3/2 5:53:33

Very impressive posting. Thank you for your efforts.

Conrad

2017/3/2 5:53:33

Quite useful and impressive info.

Factor

2017/3/2 5:53:33

Very valuable!

Chris Bethea

2017/3/2 5:53:33

Interesting and useful!

Sebastian Charlak

2017/3/2 5:53:33

Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.

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