I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about 0.5%. Does the gold completely disolved in the solder? The product may be in use for up to 10 years. (I'm tinning now)
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