I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing force because on board will have many components and each of component may require different testing force ,anyone can help me? 2.)Can I measure the height of glue or measure the glue volume after printing on board but before placement component like as the solder paste thickness to confirm this process? and anyone already implement this method in your process ,please give me the result and suggestion the method .