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PCB Manufacturing

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PCB manufacturing consists of many steps, such as PCB CAM, Panelization, Copper patterning, etc. This group is mainly talked about the problems during PCB manufacturing!

Community > Groups > PCB Manufacturing > For a 4 layers PCB, covering with ground polygon on Layer 1 and 4 necessary?
For a 4 layers PCB, covering with ground polygon on Layer 1 and 4 necessary?
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The 4 layers PCB layout I am designing is as following. Layer 1: Top signal (high speed) Layer 2: Ground plane Layer 3: Power plane (5v, 3.3v, 1.8v) Layer 4: Bottom signal (normal speed) Since now I already got a dedicated Ground plane, my question is: After finished all the routing, for Layer 1 & 4, should I still cover all the emptied space with Ground as well?
Statement: This post is only the personal view of the author and does not represent the opinions of

Ronnie Walker

I would say the ground pour is ok, but increase the clearance gap beyond what you normally use, to improve manufacturability, since the benefit is limited.


The answer is yes.


To provide Ground Planes into the Top layer and Bottom Layer is a good practice. If you can't accommodate in the Top/Bottom layers, Make sure that you make a Top-Bottom Via which connects in the internal plane. This reduces the current return paths. Gener


Truly enjyed reading your posts.

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