Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > faut with a 672 BGA
faut with a 672 BGA
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I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works.
Clearly there is an issue with the wetting of some Balls causing a poor connection.
My profile looks spot on -
I think I posted this before but never really came to any conclusion ..
What tests can I get carried out to pinpoint the problem?
Statement: This post is only the personal view of the author and does not represent the opinions of

Chris Duca

Inictllgenee and simplicity – easy to understand how you think.


Bravo! Hope you can write soon.


I am so glad that you shared this useful information with us. It is pretty helpful.Hope you can write again.


Interesting and useful!


Nice posting! Your sharing is quite in-depth and solves my puzzles all the time. I will keep reading your post.

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