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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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faut with a 672 BGA

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pm_legrand

All,

I have an intermittent faut with a 672 BGA where it fails in test but upon applying pressure to the BGA it works.

Clearly there is an issue with the wetting of some Balls causing a poor connection.

My profile looks spot on -

I think I posted this before but never really came to any conclusion ..

What tests can I get carried out to pinpoint the problem?

22 likes

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2017/2/28 21:05:26

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Chris Duca

Inictllgenee and simplicity – easy to understand how you think.

2017/3/2 21:05:26

Luca

Bravo! Hope you can write soon.

2017/3/2 21:05:26

Bleacher

I am so glad that you shared this useful information with us. It is pretty helpful.Hope you can write again.

2017/3/2 21:05:26

ALuKa

Interesting and useful!

2017/3/2 21:05:26

Chester

Nice posting! Your sharing is quite in-depth and solves my puzzles all the time. I will keep reading your post.

2017/3/2 21:05:26

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