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We just got new boards in that have ENIG pads. In the past we had a problem with too much gold getting into the wave solder pot from large connectors getting tinned at the wave. Do we have to worry about too much gold getting into the pot with this kind of finish? We are still a tin/lead operation, and use Kester 186 Rosin Flux in a foam. Is there anything specific that we should look out for when soldering to ENIG covered pads? Thanks for the help.
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