More than ever before, product experiences are being driven by customer interaction (i.e., seeing, touching) with the physical, mechanical model. The necessity to constantly satisfy the senses of the physical experience requires that printed-circuit-board (PCB) assemblies be smaller and denser to fit pre-conceptualized mechanical structures.
The mechanical model becoming such an influential factor has turned flexible electronics into an increasingly common, and significant, design objective. To gain this flexibility, designers often opt for rigid-flex PCBs, which combine both the rigid and flexible substrates of a PCB into a single design element.
Despite its numerous benefits, rigid-flex PCB design presents significant challenges in terms of effective, efficient execution. Among the many variables that go into the rigid-flex PCB design process, the greatest challenge faced by designers is ensuring that all flexible sections on the PCB fold in the correct way, while maintaining flex-circuit stability and product lifespan at the highest feasible degree of quality.