One of our divisions is having this problem:
- De-wetting on the smt pads and componenent termination on the bottom side after top side procssed through reflow. Board finish is immersion silver.
? Any recommendation on what we should check & verify * Problem is random in nature. Not component related * De-wetting only on the bottom side after top side reflow * De-wetting only on chip components/pads * There are vias on pads but the problem is not correlated with these pads * No apparent contamination on the pads * Have not verified the immersion silver thickness
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