Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due to the non balance shape of the device. The size of the brick is 1.495"x0.87". Has anyone ever experienced using this kind of part package? Does the reflow temperature need to be adjusted higher? Any concerns at all? Thanks for your inputs.