Is there anyone know the correct way to obtain the accurate temperature profiling for oven reflow? Are below claims true?
(1) Instead of full components on the PCBA (Motherboard), the profile taken from PCBA with few components
can be considered accurate. In other words, reflow profile from incomplete PCBA(Some SMT components are not mounted) is the same as reflow profile from PCBA with full complete component mounted. (2) This component(DPAK type) has heat sink at the bottom and is located on the big copper layer area (Light geen solder mask color indicate copper layer underneath). Question: In this case, attach thermocouple wire to the component lead is sufficient to obtain accurate temperature profiling.
These 2 claims sounds weird to me but I need confirmation from expert here.
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