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I have a question on component placement 1)for solder paste ,do we need to press the component into solder paste during placement process? 2)how we define force for Smt component..sometimes we add force for certain BGA?any guideline? Pls advise
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Ellis
2/4/2017 3:45:46 PM
Your sharing is quite useful to my new project. Thanks a lot.
Sinan Atilla
2/4/2017 3:45:46 PM
I must say you have very interesting posts here.
Chris Bethea
2/4/2017 3:45:46 PM
Marvelous post. Appreciate it very much.