A question for you all!
Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't.
My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch QFP's because the water molecules (that was the reason often given) couldn't evacuate particulate material left under components. What's changed - especially concerning CSP's as uBGA's etc. with clearances under 10 mils under them.
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