Thank you very much for your valuable suggestion! We will solve it as soon as possible!


Group Administrators: 1 | Group Member: 21 | Group Threads: 20

Pad cratering is a mechanically induced fracture in the resin between copper foil and outermost layer of fiberglass of a printed circuit board (PCB). It may be within the resin or at the resin to fiberglass interface. Do you have ever problems about pcb pads? please talk here.

Community > Groups > PCB Pad > Can Non-Functional Pads be Removed in PCB?
Can Non-Functional Pads be Removed in PCB?
Alternate Text 1K+
Alternate Text 1
Alternate Text 380


High-speed signals have been a hot topic that can't be avoided by communication industries. With the increase on amount of transmitted information and transmission speed rate, high-speed signals have become gradually significant. High-speed PCB (Printed Circuit Board) is a loading board of high-speed signals and its material selection, manufacturing technology and routing design all affect quality of high-speed signals. Non-Functional Pad, short for NFP, is a technological method to manufacturing high-speed PCB while insertion loss is one of the most important parameters indicating signal quality. To remove or to keep NFP has been an inevitable discussion topic between engineers and manufacturers. In this article, influence of NFP on insertion loss of high-speed signals will be analyzed from the perspective of manufacturing procedure in an experimental method. Whether to remove or to keep unused pads, you can find an answer in this article.
Statement: This post is only the personal view of the author and does not represent the opinions of


Awesome post. Like it very much.

Hot Threads

New Threads