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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > California North State Manufacturers Expo
California North State Manufacturers Expo
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BGA Rework Stations
It is this week! Come and meet with the top manufacturer's in Butte County, CA. A great place for job seekers, students, and companies looking to re-locate to a more desirable area to conduct business.
Visit Precision PCB Services, Inc. at booth #27.
The California North State Manufacturer's Expo will be held at the CSU, Chico Campus. There will be company exhibits, round table discussions and a tour of the CSU Chico Department of Engineering Labs.
Statement: This post is only the personal view of the author and does not represent the opinions of

Luc Vercruysse

Remarkable.I have learned a lot from your post.

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