We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's that are several years old, we are not sure how they have been stored prior to our receipt. Is there anything that can be done prevent the growth of this corrision on the remaining BGA components? Best regards
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