Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Black pad on BGA
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We have seen the black dot on the BGA pad after the component has been removed from a PCB. When most likely could this corrosion have occurred, while the component was in storage, during manufacturing of the unit? We have a number of these BGA's that are several years old, we are not sure how they have been stored prior to our receipt. Is there anything that can be done prevent the growth of this corrision on the remaining BGA components? Best regards
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Michal Olszak

I really appreciate your content.Good resource for new beginners.

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