Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGAs
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avonchia

After switching from No-clean flux to Water soluble (Kester)we encountered voids problem (X-ray and microsectioning). Reducing the apperture sizes made the voids smaller but did not eliminate them. So we had to go back to No-clean. Any idea why voids occur? Will appreciate any answer.
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Eibert Draisma

Bravo! Hope you can write soon.

Bradley

Remarkable.It help me a lot. Thank you.

ingcaschera

Pretty good and useful info for beginners.

Chapman

It was truly informative. Your post is very useful.Many thanks for sharing!

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