Thank you very much for your valuable suggestion! We will solve it as soon as possible!


Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA warpage
BGA warpage
Alternate Text 457
Alternate Text 0
Alternate Text 7


I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I have had intermittent problems with the pins on the corners. How can I mesure if the level of warpage is acceptable ? What measures can I take to minimize the effect of this warpage.
Statement: This post is only the personal view of the author and does not represent the opinions of

Michele Deligio

Remarkable.I have learned a lot from your post.

Roberto Dias

It answered all my puzzles.Very helpful.

William Paul

It answered all my puzzles.Very helpful.

My favorite psot here. Its very impressive and helpful.

Sergey Alexandrovich

Awesome post. Like it very much.

Hot Threads

New Threads