bga warp | ALLPCB

Thank you very much for your valuable suggestion! We will solve it as soon as possible!

Name *
Email *
Phone Number
Message *

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > bga warp

Post A Thread

bga warp

448

robladanyi

Hi,

I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This bga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge.

35 likes

Likes

2017/2/2 9:16:38

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.