Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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bga warp Reply 2017-02-02 09:16:38
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robladanyi

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Hi,
I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This bga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge.
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Tayfun Karan

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Please keep doing your great job.

Andy

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Useful!

reilhacpierre

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Thanks for the article. Very valuable.

Berger

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Great thanks for your helpful info. Really useful.
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