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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA substrate pad alloy
BGA substrate pad alloy
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Is there a typical alloy used by vendors on the substrate pad? What is their process used to attach a eutectic ball to that pad? Thanks.
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philip lambert

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Jorge Arizaga

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