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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA substrate pad alloy

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rownickijan

Is there a typical alloy used by vendors on the substrate pad? What is their process used to attach a eutectic ball to that pad? Thanks.

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2017/2/28 4:39:21

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

philip lambert

I am happy that you shared this helpful information with us.

2017/3/2 4:39:21

gilfredo_aguilar

I am going to keep checking for new writings.

2017/3/2 4:39:21

Darnell

Quite useful and impressive info. I have learned a lot from your article and I will keep on reading your sharing.

2017/3/2 4:39:21

Jorge Arizaga

Your post answered my questions. Thanks a lot.

2017/3/2 4:39:21

christian.holmberg

I was really confused, and this answered all my qutoiesns.

2017/3/2 4:39:21

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