BGA, stress on the PCB

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Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA, stress on the PCB Reply 2017-02-02 01:10:40

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Brady

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I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and when you press on it the balls paste to the BGA or PCB.

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Reply 2017-02-02 01:10:40

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