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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA, stress on the PCB

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Brady

I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and when you press on it the balls paste to the BGA or PCB.

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2017/2/2 1:10:40

Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Lebrun Bernard

Your post answered my questions. Thanks a lot.

2017/2/4 1:10:40

kementze19

I am going to keep checking for new writings.

2017/2/4 1:10:40

neil.edlin

I like checking your post and hope your update comes soon.

2017/2/4 1:10:40

henry.kjonsberg

This post is really interesting.

2017/2/4 1:10:40

Yair Almanza Armenta

You did a great job. Really appreciate your content.

2017/2/4 1:10:40

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