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BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA, stress on the PCB
BGA, stress on the PCB
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Brady

I've a problem with a BGA. I've the impression that the balls broke then there is a too big mecanical stress on the PCB. I lost some dBm and when I press on the BGA I measure the good value! It's like the balls are take off the BGA or PCB and when you press on it the balls paste to the BGA or PCB.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Lebrun Bernard

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kementze19

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neil.edlin

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henry.kjonsberg

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Yair Almanza Armenta

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