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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA step by step
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etb2.binsbergen

I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA.
I Hope than you send my information about this.
28 likes
2017/2/2 4:51:21
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Calvin

A good and help piece of info.
2017/2/4 4:51:21

Franco Piccirelli

Remarkable.I have learned a lot from your post.
2017/2/4 4:51:21

Luis Moreno

Good resource for new beginners.
2017/2/4 4:51:21

j.rattanavongsa

I appreciate your article very much. Wait for your next writing.
2017/2/4 4:51:21
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