Thank you very much for your valuable suggestion! We will solve it as soon as possible!


Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA step by step
BGA step by step
Alternate Text 413
Alternate Text 0
Alternate Text 28


I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA.
I Hope than you send my information about this.
Statement: This post is only the personal view of the author and does not represent the opinions of


A good and help piece of info.

Franco Piccirelli

Remarkable.I have learned a lot from your post.

Luis Moreno

Good resource for new beginners.


I appreciate your article very much. Wait for your next writing.

Hot Threads

New Threads