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BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA step by step
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etb2.binsbergen

I need know the types, characteristic specials for temperature, general characteristics and all I need know about of manufacturer for BGA.
I Hope than you send my information about this.
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Calvin

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Franco Piccirelli

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Luis Moreno

Good resource for new beginners.

j.rattanavongsa

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