BGA Solderability Standard

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Solderability Standard

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Daniel Gilbert

It's been a while since BGA usage become widespread. Ton's of articles had been written with regards to design, processing, techniques, inspection etc...but it seems like there's still no hard ground for standards and IPC 7095 doesn't cover everything specially solderability issues. I maybe wrong but I'm after a solderability standard that is effective and can be used by QA, Process and Manufacturing. The way I see it, every experience with BGA seems to be contested as there is no written standards available from IPC or certain body governing electronics solderability.

What is your standard when it comes to solderability?

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2017/2/2 23:40:29

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