It's been a while since BGA usage become widespread. Ton's of articles had been written with regards to design, processing, techniques, inspection etc...but it seems like there's still no hard ground for standards and IPC 7095 doesn't cover everything specially solderability issues. I maybe wrong but I'm after a solderability standard that is effective and can be used by QA, Process and Manufacturing. The way I see it, every experience with BGA seems to be contested as there is no written standards available from IPC or certain body governing electronics solderability.
What is your standard when it comes to solderability?
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