Dear All :
1- We assemble mixed technology boards. For some reasons, sometimes we store them semi assembled (only SMT). Knowing that they have plastic BGA,s , can the wave solder m/c affect or damage those BGA,S on continuation their production?
If yes, then how to avoid ?
2- Also when repairing boards with BGA,S , how to avoid damaging the BGA,s while removing ? I mean some damages like buckling & I am interested because we have to reball them again for reuse.