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BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Reliability
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babinyecz

Hi
Does anyone know of any studies carried out comparing long term reliability of BGAs with their equivalent QFPs etc.
If you were designing a critical product in the aerospace field would you go for the BGA or QFP version of the same IC? Based on what evidence?
All answers gratefully received.
4 likes
2017/2/27 4:30:33
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Bob

Your post answered my questions. Thanks a lot.
2017/3/1 4:30:33

Rui Cadete

Thanks for your intelligence. Pretty interesting and useful.
2017/3/1 4:30:33

Frank Dembski

It answered all my puzzles.Very helpful.
2017/3/1 4:30:33

carlos.pinto5

Remarkable.
2017/3/1 4:30:33

M.?Aznar

Helpful!
2017/3/1 4:30:33
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