BGA reflow on bottomside

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Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA reflow on bottomside Reply 2017-02-02 20:27:03

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Eugene Shamaev

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Hi all,

I have never had to run a product with BGAs on the bottomside of a double sided board. I was just wondering if this is a done thing ? or should I stay well clear.

any replies appreciated.

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Reply 2017-02-02 20:27:03

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