Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA Pad Cratering
BGA Pad Cratering
Reply
Alternate Text 495
Alternate Text 0
Alternate Text 36

aesistemas

This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them in the section we did. The lab is calling this pad cratering. The BGA was soldered in a 7 zone Vitronics Soltec oven and when thermocoupled we saw: Peak Temp: 245C, Max Slope: 2.89, Time above liquidus: 62 seconds. We use SAC305 Indium paste. Any help would be appreciated.
36 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Ellis

Your sharing is quite useful to my new project. Thanks a lot.

Kermit

I have share it with my classmates. They all appreciate it a lot.

Bertram

Wow, these helpful info benefit me a lot. Great thanks to you.

Hot Threads

New Threads