Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Pad Cratering
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This is from a section of an ALtera EP2SGX130-5 STRATIX 2 leadfree 1,508 ball BGA. What can be causing this? It is from an unused board (not assembled in a unit, or in the field, but it did pass electrical and function test. There are three of them in the section we did. The lab is calling this pad cratering. The BGA was soldered in a 7 zone Vitronics Soltec oven and when thermocoupled we saw: Peak Temp: 245C, Max Slope: 2.89, Time above liquidus: 62 seconds. We use SAC305 Indium paste. Any help would be appreciated.
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