Thank you very much for your valuable suggestion! We will solve it as soon as possible!


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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Bga failures
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Ivan Dario

We have a board that has failed at burn in.
There is a 672 BGA on the board. When the test guy presses down on the BGA the board will pass !
What am I looking at here? Board finish is ENIG - could this be black pad / what should I do to diagnose the problem?
Any advise very much appreciated.
Statement: This post is only the personal view of the author and does not represent the opinions of


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Guillaume Leblanc

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Michal Olszak

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