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BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA Device with Slanted and Damaged Spheres
BGA Device with Slanted and Damaged Spheres
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kalman.kovacs

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the test fixture to shear the spheres in certain areas. The component manufacturer claims that 50% sphere damage and .008" slant of the balls is acceptable. I have never seen a BGA that exhibited this condition even reballed devices. We process hundreds of thousands of BGA's through our plant each year and have never fought an issue of this magnitude before. Does anyone have any insight or similar experience. Your comments and thoughts are appreciated.
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