Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA ball and PCB pad
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Boyd

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the performence of solder joint? Please advise!

9 likes
2017/2/2 1:19:00
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

ondrasebesta

Thanks for your sharing.It helps me a lot.
2017/2/4 1:19:00

Clyde

A great sharing for beginners. Thanks for your efforts and I will follow you and keep reading your posts.
2017/2/4 1:19:00

Francisco

I have truly impressed by your post. Please keep us up to date like this.
2017/2/4 1:19:00

andrewr

Quite useful and impressive info.
2017/2/4 1:19:00

Fatih YASAR

I am going to keep checking for new writings.
2017/2/4 1:19:00
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