BGA ball and PCB pad

2017/2/2 1:19:00

Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the performence of solder joint? Please advise!

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Post Comment

ondrasebesta

2017/2/4 1:19:00

Thanks for your sharing.It helps me a lot.

Clyde

2017/2/4 1:19:00

A great sharing for beginners. Thanks for your efforts and I will follow you and keep reading your posts.

Francisco

2017/2/4 1:19:00

I have truly impressed by your post. Please keep us up to date like this.

andrewr

2017/2/4 1:19:00

Quite useful and impressive info.

Fatih YASAR

2017/2/4 1:19:00

I am going to keep checking for new writings.

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