Thank you very much for your valuable suggestion!
We will solve it as soon as possible!
BGA ball and PCB pad
Hi all, These days our customer asks us to figure out ,during reflow,the BGA ball and solder paste,which will first melt? I think it's very hard to get the rusult.coz I think it'll vary at diffrent part of the BGA,and how can this affect the performence of solder joint? Please advise!