Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

Group Administrators: 1 | Group Member: 96 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA > BGA and Land Patterns
Post A Thread
BGA and Land Patterns
Reply
Alternate Text 366
Alternate Text 5
Alternate Text 20

Gabe

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference?
20 likes
2017/2/2 5:19:40
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

servimatec

incredible work
2017/2/4 5:19:40

Luigi Salvatore

Great help to my new project.
2017/2/4 5:19:40

vintageamplification

Thanks for your intelligence. Pretty interesting and useful.
2017/2/4 5:19:40

zvonimir

Interesting!
2017/2/4 5:19:40

Charles

Very helpful and valuable.
2017/2/4 5:19:40
Reply

Hot Threads

New Threads

About Us
About Us
Why Us
Contact Us
News
Products & Service
PCB Capabilities
SMT-Stencil
Sponsorship
Electronic Promotion Activity
Quotation & Feedback
Online Auto-Quotation
Quotation by Sale Rep
Customer Reviews
Help Center
FAQ
Community
Activity List
Resource Details
PCB Software
Units Conversion

service@ALLPCB.com

tel0086 18106589806

Certification: Certification Our Preferred Partners: Our Preferred Partners
Follow Us:

Please send Gerbers to service@ALLPCB.com for quotation © ALLPCB.com,All Rights Reserved Privacy PolicySitemap

Secure Site by GoDaddy.com This site has earned the McAfee SECURE certification.