Thank you very much for your valuable suggestion! We will solve it as soon as possible!

BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA and Land Patterns
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Gabe

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference?
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servimatec

incredible work

Luigi Salvatore

Great help to my new project.

vintageamplification

Thanks for your intelligence. Pretty interesting and useful.

zvonimir

Interesting!

Charles

Very helpful and valuable.

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