Category:PCB Assembly SMT Stencil

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The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

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lead-free stencil printing Reply 2017-02-28 01:39:31
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Csaba Simon

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hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". The density of Sn-37Pb paste is 8.4 gm/cm3 and for lead free alloy the density is 7.4 gm/cm3. Would this change in density have any effect on printing.
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

julien.brasart

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Impressive and helpful.

effevalerio

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Remarkable.

MarcBlade

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Remarkable.I have learned a lot from your post.

Arnold

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Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.
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