Category:PCB Assembly SMT Stencil

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The purpose of an SMT stencil is to transfer solder paste to a bare circuit board. Before the assembly of the SMT components solder paste is printed onto the component pads of the printed circuit board by stencil, which are today usually manufactured from steel, more rarely from nickel or polyimide.

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Wet or Dry Wipe for under stencil wiping Reply 2017-02-28 23:14:43
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john brooks

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What is the preferred method of under stencil wiping? (Wet or Dry wipe)
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Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

gyula.loosz

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Impressive and helpful.

Sinan Gunay

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I am happy that you shared this helpful information with us.Please keep us up to date like this.

Enrique Ochoa

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I am going to keep checking for new writings.

Gyorgy Koncseg

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Thanks for your intelligence. Pretty interesting and useful.
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