Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 98

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
Solder Paste to Device (BGA) or PCB Reply 2017-02-02 01:07:46
206 views
5 comments
10 likes

Adair

Leave A Message

Follow

Can anybody tell me which is better; to paste to BGA or to paste to PCB? What are the pitfalls when pasting to BGA?
10 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Allen Litton

Leave A Message

Follow

Remarkable.I have learned a lot from your post.

ingcaschera

Leave A Message

Follow

Pretty good and useful info for beginners.

Mike

Leave A Message

Follow

Bookmarked.Really helpful.

Benjamin

Leave A Message

Follow

I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.

Calvin

Leave A Message

Follow

Excellent work. I am impressed.
ThreadReply