SHENMAO PF606-P133 Solder Paste is designed for selective laser soldering on tiny solder joints (1.5mm or smaller), especially on expensive, temperature-sensitive components and assemblies. In the past, such a small solder joint is not suitable for standard reflow processes and has to be soldered manually. With PF606-P133 Solder Paste, automatic laser soldering can easily be accomplished.
Within only several seconds of heating after dispensing, solder joint is well-formed with minimal flux residue and without splash or solder ball. Process time can be greatly reduced with extremely high yield rate.
PF606-P133 is approved by world leading electronic component manufacturers.
As the World’s Major Solder Materials Provider, SHENMAO produces SMT Solder Paste
, Wave Solder Bar, Solder Wire and Flux, Solder Preforms, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Dipping Flux and PV Ribbon.