Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 ball BGAs. The pitch is .8 mils and the ball diameter is .45 mils. The package is 16 x 8 mils. Now I know there are probably much worse challenges out there but we are having issues getting consistantly accurate places from the P&P. Also I am seeing issues with paste clogging and not transfering to the PCB during the stenciling process. We are using a 5 mil thick stencil with 1:1 aperture to pad size. Any recomendations?
There is a TSOP version of this part that I am trying to get engineering to switch to to save me some headaches but in the meantime i need to make the best of what ive got.