Samtec, Broadcom Demo 200G Copper at DesignCon Samtec and Broadcom demo 200G copper tech with Si-Fly HD at DesignCon 2025, showcasing 224G PAM4 interconnects for AI and data centers. 200G 224G AI Broadcom cable chip copper data center DesignCon 2025 HD high-density interconnects PAM4 Samtec SERDES Si-Fly Solutions system July 14, 2025
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