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Embedded motherboards are core hardware platforms designed for embedded systems, widely used in industrial control, the Internet of Things, and medical devices. The following provides a detailed overview of embedded motherboards.
1. Core characteristics of embedded motherboards
Compact size: Typically small-form-factor designs (for example Mini-ITX, NUC, or System on Module), suitable for space-constrained environments.
Low power consumption: Optimized for long-term operation, with power consumption down to a few watts (for example ARM architectures), suitable for fanless designs.
High reliability: Support for wide operating temperature ranges (-40°C to 85°C), dust and shock resistance, and compliance with industrial standards such as MIL-STD-810G.
Customizability: Support for hardware interface trimming (for example GPIO, CAN bus) and software system customization (Linux, RTOS).
2. Typical application scenarios
Industrial automation: PLC control, robots, and production line monitoring (for example Advantech industrial motherboards).
Smart terminals: Self-service kiosks, digital signage, and POS terminals (common solutions based on Rockchip RK series).
IoT edge computing: Data acquisition and gateway devices (for example Raspberry Pi CM4 module).
Medical equipment: Portable monitors and imaging processors, which may require FDA or IEC 60601 certification.
3. Comparison of mainstream architectures
| Architecture | Representative chips | Advantages | Typical applications |
|---|---|---|---|
| ARM | NXP i.MX8, Rockchip RK3588 | Low power consumption, high integration | Mobile devices, edge computing |
| x86 | Intel Atom, AMD Ryzen V1000 | High performance, Windows compatibility | Machine vision, digital signage |
| RISC-V | Allwinner D1, T-Head XuanTie | Open and flexible, cost-controllable | Emerging IoT devices |
4. Key selection factors
Compute requirements:
Lightweight tasks (sensor data collection): Cortex-A7/A53 class processors (500 MHz–1.5 GHz).
AI inference or multimedia processing: require NPU, for example Rockchip RK3588 with around 6 TOPS.
Interface expansion:
Industrial scenarios typically need RS-485, CAN bus, and isolated DI/DO.
Multimedia requirements may require HDMI 2.0 and CSI camera interfaces.
Environmental suitability:
Wide input voltage (for example 9–36 V DC) and EMC anti-interference design.
High-humidity environments may require conformal coating.
Development support:
Completeness of the BSP package (Linux kernel version and driver support).
Whether the vendor provides an SDK or toolchain (for example NVIDIA Jetson CUDA toolchain).
5. Development considerations
Thermal design: For enclosed environments, calculate thermal design power (TDP) and prefer aluminum enclosures for passive cooling.
Power management: Use industrial-grade DC-DC modules with wide input voltage ranges.
Firmware security: Enable Secure Boot and use TPM 2.0 to prevent unauthorized firmware updates.
Long-term supply: Prefer models with lifecycle support of 10 years or more for critical applications.
Choosing an embedded motherboard should balance real-time requirements, reliability, and cost for the specific application, and include assessment of supply chain stability. For critical applications, consider designs that include watchdog timers and redundant power supplies.
