Category:Electronic Components Packaging Technology

Group Administrators: 0 | Group Member: 18 | Group Threads: 12

Having problems with component package? THT or SMT? Join us and learn together.

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Search Results: 12 Threads,2 Pages
5 answers
197 views

QFN Packages

We are developing a new product, and some of the designers are proposing QFN packages. These look like leadless QFP's. We don't currently use anything like this, but we operate in a high reliability a... (See More)

rayy2007
2017-02-28 01:14:42
Nikolay Dovgilov
2017-03-02 01:14:42
4 answers
100 views

Heat Sink for QFP

Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this?... (See More)

david.rambeau.tea
2017-02-27 23:54:03
Csaba Simon
2017-03-01 23:54:03
1 answers
762 views

Something about PCB/IC Package Design Tool

In one integrated environment, designers can now implement gigabit serial interfaces in high-speed printed-circuit-board (PCB) systems. Version 15.0 of Cadence's packaging design environment includes ... (See More)

dydzld765lebl9
2017-02-08 01:56:42
hlmcorreo
2017-02-10 01:56:42
4 answers
132 views

MLP (Micro Leadframe Package)

Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these cri... (See More)

Benedict
2017-02-02 01:54:46
John
2017-02-04 01:54:46
4 answers
198 views

SMT package to feeder size chart

Was wondering if anyone has a general chart matching SMT package size with tape feeder size. E.g 0602: 8mm Tape 2mm pitch. (See More)

uooa
2017-02-01 19:03:45
ALuKa
2017-02-03 19:03:45
1 answers
98 views

Design in Package Flexibility into PCB

To err is human. And to order the wrong component foot print is just part of engineering. It happens to us all; You’re working hard to finish a design, you have PCBs on the way and you’re putting in y... (See More)

etb2.binsbergen
2017-02-01 16:27:58
makersoutpost
2017-02-03 16:27:58
4 answers
232 views

DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Hi, We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. Any good suggestion ... (See More)

Paolo
2017-02-01 13:43:53
Sergio Vasconcelos
2017-02-03 13:43:53
2 answers
270 views

Multitest’s Solution for 3D Packages Released to Production Electrical test

Multitest InStrip3D, Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers(IDMs) and final test subcontractors worldwi... (See More)

Thomas FAUCHERE
2017-01-31 22:19:26
Kulasekaran
2017-02-02 22:19:26
1 answers
1890 views

Package Offers Flip-Chip Support

To help automate the interconnect process between bare die and a pc board, PowerBGA 3.0 provides flip chip design tools, support for design reuse methodologies with a new physical design reuse (PDR) m... (See More)

Garry Thorn
2017-01-21 17:09:43
selcukbircan
2017-01-23 17:09:43
1 answers
2024 views

The Thermal Design in Exposed-Pad Packages

This technical brief discusses thermal design techniques for IC packages—such as QFN, DFN, and MLP—that incorporate an exposed thermal pad. Most designers are by now quite familiar with integrat... (See More)

Mustafa ozcelik
2017-01-19 20:39:51
info
2017-01-21 20:39:51
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Search Results: 12 Threads,2 Pages