Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Search Results: 100 Threads,10 Pages
5 answers
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large bga capable placement machines

Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although ... (See More)

Cecil
2017-02-02 00:43:25
javier mainar val
2017-02-04 00:43:25
4 answers
66 views

MARTIN to Demonstrate Standalone BGA Reball and QFN Solder Bumping Unit

MARTIN Standalone BGA Reball and QFN Solder Bumping Unit. MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, ... (See More)

Devin
2017-02-02 00:31:02
Albert Palau Llort
2017-02-04 00:31:02
5 answers
133 views

Reflowing BGA balls to a PCB surface

Here's a good one!!! I've got a customer who is designing a small circuit board, and they want to reflow BGA solder balls directly to the bottomside of the PCB to effectively create a BGA style interf... (See More)

filippo.lalli
2017-02-02 00:04:55
Francisco
2017-02-04 00:04:55
5 answers
135 views

45 mil ball diameter BGA

Good day all, we are having problems with some new BGAs that are slowly filtering their way into our designs. Engineering really wants to use them and I am pressured to make them work. They are 54 bal... (See More)

Cleveland
2017-02-01 23:59:49
Antal Levente
2017-02-03 23:59:49
4 answers
80 views

BGA short

Hi, I'm having a lot of problems with BGA's shorts, we are using 0.005" stencil aperture 1 to 1 (0.014)", the paste is centre (I can not measured the height)was verified using electronic microscopie, ... (See More)

adam
2017-02-01 23:15:28
Eduardo Gonzalez
2017-02-03 23:15:28
4 answers
120 views

BGA ball and land design problem

Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm ... (See More)

nestandart
2017-02-01 18:26:27
Oguz AGCELI
2017-02-03 18:26:27
4 answers
104 views

0201/Micro BGA PCB Tolerance

Hi Everyone My company has done loads of 0402 placements but are now required to start looking at 0201 and micro BGA placements. I’ve done loads of research and I’m happy with stencil design, area rat... (See More)

juan
2017-02-01 18:23:11
ahmet_gacar
2017-02-03 18:23:11
1 answers
115 views

California North State Manufacturers Expo

BGA Rework Stations It is this week! Come and meet with the top manufacturer's in Butte County, CA. A great place for job seekers, students, and companies looking to re-locate to a more desirabl... (See More)

peter.moloi
2017-02-01 17:57:50
Luc Vercruysse
2017-02-03 17:57:50
4 answers
82 views

SPC/Calibration for BGA rework machine

What do other people use to ensure that the BGA machine is within spec ie beform a weekly check and record on SPC charts? We want to start recording this can a plate or some kind of surveyor be ... (See More)

Indi
2017-02-01 17:36:13
Lukas Krehel
2017-02-03 17:36:13
4 answers
139 views

Lead-free BGA in Tin/Lead Process

I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions o... (See More)

markarice5
2017-02-01 17:14:31
Worge
2017-02-03 17:14:31
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Search Results: 100 Threads,10 Pages