Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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3 answers
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how does BGA optical systems work on profesional systems?

Hi, Can anyone explain how BGA optical systems work on professional systems? What optics is used? (See More)

MelA1
2017-02-01 15:09:47
Baldwin
2017-02-03 15:09:47
4 answers
160 views

How to calculate BGA height change?

Does any one know how to calculate BGA height change after reflow oven?I guess the calculation will be based on the component size, weight, ball diameter and ball count of the BGA, but how to get the ... (See More)

Alex
2017-02-01 14:46:47
Garry Thorn
2017-02-03 14:46:47
4 answers
108 views

BGA reflow profile

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on ... (See More)

Nigel Nichols
2017-02-01 13:42:32
Paolo
2017-02-03 13:42:32
4 answers
95 views

BGA questions

Hi, I would like to get in contact with people that have knowledge about the BGA mounting process. Please drop me an e-mail. (See More)

James Kent
2017-02-01 13:19:32
francois.jacob.hello
2017-02-03 13:19:32
3 answers
87 views

BGA

Hi: Can you give me some tips for choose a BGA rework system? Where can I buy this machines? Thanks for your help! (See More)

Antonio Semeraro
2017-02-01 08:33:22
Eric Flores Solis
2017-02-03 08:33:22
1 answers
1632 views

BGA Breakouts and Routing

Call it a “vanity” publishing project if you will, but Charles Pfeil’s book, BGA Breakouts & Routing, published by his employer, Mentor Graphics, is more than worth the price of admission. Pfeil, ... (See More)

Piero
2017-01-25 14:01:20
theubo
2017-01-27 14:01:20
1 answers
1899 views

About Flip-Chip BGA Failure Mechanisms

We’ve all heard that those who forget history are doomed to repeat it, and our school systems work hard to teach students how to avoid those painful, misery inducing historical mistakes. Similarly, if... (See More)

Adrian Wellings
2017-01-21 17:57:35
dayji
2017-01-23 17:57:35
1 answers
1758 views

Common Mistakes in BGA Rework

Ball Grid Array rework is one of the most challenging procedures performed at assembly facilities and repair depots around the world. Doing it right depends in large part on the skills and knowledge o... (See More)

Bernard
2017-01-21 06:20:58
Terry Lenny
2017-01-23 06:20:58
1 answers
1988 views

BGA Design Tips

Source: BGA NET COMPANY I was asked by many PCB designers about BGA design guidelines, say ball PAD size, pitch size, annular ring, layer counts, solder mask opening, etc. There is no ready answ... (See More)

Buck
2017-01-18 08:27:29
David Russell
2017-01-20 08:27:29
1 answers
2059 views

Reagrding Test and BGAs on PCBs

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.... (See More)

Caesar
2017-01-17 09:30:41
Chisel
2017-01-19 09:30:41
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