Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA testing - Xray Reply 2017-04-27 01:52:54
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Benedict

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We are starting to use high count BGAs (512). Is there an industry standard on how to inspect the BGAs. Should all BGAs be inspected with Xray equipment or is there other solutions? Thank you
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Burnell

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I read this article completely regarding the resemblance of most up-to-date and previous technologies, it’s remarkable article.
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