Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA substrate pad alloy Reply 2017-02-28 04:39:21
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rownickijan

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Is there a typical alloy used by vendors on the substrate pad? What is their process used to attach a eutectic ball to that pad? Thanks.
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philip lambert

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gilfredo_aguilar

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Darnell

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Jorge Arizaga

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Your post answered my questions. Thanks a lot.

christian.holmberg

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I was really confused, and this answered all my qutoiesns.
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