Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Repair Problems Reply 2017-02-28 13:42:29
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Sergey Alexandrovich

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Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple profiles. Now going to try dispensing paste with Camelot using a profile on the lower end of the window. It should reduce the peak temperature and time in reflow, hopefully will not warp. We have baked the parts prior to trying to reflow them. Could use help with this problem part, "Chip Express" Thanks in advance
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Nigel Nichols

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I appreciate your article very much. Wait for your next writing.

Ciurdar Gabriel

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Bookmarked.Really helpful.

Darnell

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Quite useful and impressive info. I have learned a lot from your article and I will keep on reading your sharing.

Bartlomiej Hydrynski

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Your article answered all my puzzles.
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