Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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BGA Reliability Reply 2017-02-27 04:30:33
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babinyecz

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Hi
Does anyone know of any studies carried out comparing long term reliability of BGAs with their equivalent QFPs etc.
If you were designing a critical product in the aerospace field would you go for the BGA or QFP version of the same IC? Based on what evidence?
All answers gratefully received.
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Bob

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Your post answered my questions. Thanks a lot.

Rui Cadete

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Thanks for your intelligence. Pretty interesting and useful.

Frank Dembski

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It answered all my puzzles.Very helpful.

carlos.pinto5

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Remarkable.

M.?Aznar

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Helpful!
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