Category:Electronic Components BGA

Group Administrators: 1 | Group Member: 95 | Group Threads: 100

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Thread Reply
Soldering problem on BGA with SAC105 bump Reply 2017-02-27 21:14:09
111 views
5 comments
9 likes

Yair Almanza Armenta

Leave A Message

Follow

I need some advise from those with experience on this component. We are facing soldering problem "pillow effect"(from cross section result)on this BGA. In the reflow profile point of view which area should we focused more? The soak time or the Total Time above liquiduos? btw, we use SAC305 solderpaste. Thanks in advance for any input.
9 likes
Statement: This post is only the personal view of the author and does not represent the opinions of ALLPCB.com.

Craig

Leave A Message

Follow

Thanks for marvelous posting.

Shahzad Rafiq

Leave A Message

Follow

Great work. I really appreciate it.

José luis cordoba

Leave A Message

Follow

Thanks for your intelligence. Pretty interesting and useful.

ali.serbetci

Leave A Message

Follow

Your post answered my questions. Thanks a lot.

Jeff Hanenkrat

Leave A Message

Follow

Nice content you’ve posted in here
ThreadReply