Category:Electronic Components BGA

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A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

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Via in Pad for BGAs Reply 2017-02-26 08:25:17
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hisham.i

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Does anyone have any experience with via in pad for BGAs using conventional thru hole technology?
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John

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This post is perfect for what I need. Thanks!

Cedric

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It was truly informative. Your post is very useful.Many thanks for sharing!

Agustin

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Please keep us up to date like this.

francois.jacob.hello

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Your sharing is quite useful to my new project. Thanks a lot.

Benedict

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I think you are a genuis. The idea in your post is quite helpful and lights me. I have been puzzled for a long time in my new project.
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