Category:PCB Solder Paste
Solder paste is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by print solder paste in/over the holes.
Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benif...(view more)
Hi, We are planning to use RMA flux based Solder Paste for our line. We are currently using a No-Clean Solder Paste. Can I use an aqueous cleaner to clean my board with the above paste ? How wil...(view more)
Dear all: We had a severe curvature in our boards after wave soldering.Could a second pass in the wavesolder m/c reduce this curvature. If not then what do you recommend to solve this problem. A...(view more)
Sorry about creating a new thread, but I wanted to make sure that this didn't get buried. I was sent the files and have posted them to the library. There are three files in a single zipped...(view more)
OSAKA, JAPAN March 2009 Nihon Superior Co. Ltd., a supplier of advanced soldering and brazing materials to the global market, announces the development of SN100C P520 D5 lead-free solder paste for 040...(view more)
I have seen in the last couple of months more boards with a white hazing under the solder mask. I ran a few tests on a board to determine the cause of the white hazing underneath the solder mask. Firs...(view more)
Has anyone had any experience with 60/40 Sn/Ni(300 u in.) over Ni(300 u in.)? If so, what kind of solder issues might exist with 63/37 Sn/Pb reflow? Is a different paste needed? Also, what is the bene...(view more)
OK International (www.okinternational.com) has launched a new soldering system for PV tabbing and bussing applications proven to reduce micro cracking. The PS900 with specially designed hoof tip geome...(view more)
Hello. I have a problem with reflow soldering of PCBs with golden pads. Peste explodes in the oven. I don't know in witch phase of process (in what point of profile) it happens. It's the reason of pro...(view more)
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standa...(view more)